Our Technology partner Advantech, a leading provider of embedded IoT solutions, launches its comprehensive range of embedded computing platforms that includes the latest 8th Gen. Intel® Core™ U-Series and Y-Series processors and 9th Gen. Intel® Core™ S and H processors. Engineered with Intel’s latest processors and Advantech WISE-PaaS/DeviceOn, an IoT device operations and management solution, these embedded platforms combine fantastic performance per watt, fast connectivity, and easy operations management—making them the best selection for visual computing, IoT, industrial, retail, healthcare, transportation applications, and more.
EXCEPTIONAL PERFORMANCE AND CONNECTIVITY FOR AIOT
The latest 8th Gen. Intel® Core™ U-Series and Y-Series processors and 9th Gen. Intel® Core™ S and H processors deliver high performance per watt and enable faster wireless speeds meeting the increasing requirements for graphics, computing, and data consolidation capabilities in the AIoT era. Enhancements include up to 30% increase in computing and graphics performance with the 8th Gen. Intel® Core™ USeries and Y-Series processors, and up to a 22% increase with the 9th Gen.
POWER UP IOT DEVICES WITH 24/7 OPERATIONS MANAGEMENT
Advantech developed its latest series of embedded boards and systems based on Intel’s technologies in a wide range of form factors, including the COM Express Basic Module SOM-5899R, COM Express Compact Module SOM-6882, the 3.5” SBC MIO-5373, and the MIO-5393. Additional form factors include the Mini-ITX Motherboard AIMB-233, AIMB-276, AIMB-286, the MicroATX Motherboard AIMB-506, AIMB-586, and the Embedded PCs EPC-C301 and EPC-T2286.
The complete product lineup will be available in 2019 from Q3 to Q4. You can already find the product information includes data sheets at Aaronn Product Page and send us a product request.
ADVANTECH’S EMBEDDED PLATFORMS WITH THE LATEST INTEL® CORE PROCESSORS
COM Express Basic
SOM-5899R (Product Data sheet)
- 9th/8th Gen Intel Xeon/Core Processors COM Express Basic Module Type 6
- 3* DDI (digital display interface) 4k resolution
- 4* USB3.1 Gen 2 (10Gbps) / PEG x16 & 8* PCIe Gen3 (8Gbps)
- 6C CPU with 96GB large memory capacity
COM Express Compact
SOM-6882 (Product Data sheet)
- Intel® 8th Gen Core Processors COM Express Compact Module R3.0 Type6
- On board storage eMMC up to 64GB, TPM2.0
- High speed I/O: 4 USB3.1 (Gen2), 6 PCIe X1 (Gen3), 4 SATA (Gen3)
- Intel® 8th Gen Core Processors Product Family with Dual channel DDR4 Max 32GB memory
3.5” Single Board Computer
MIO-5373 (Product Data sheet)
- 9th Gen. Intel® Core Processor Intel® i7/i5/i3/Celeron 3.5″ SBC w/ MIOe
- Dual Channel DDR4-2400 up to 32GB, onboard eMMC up to 64GB
- Triple simultaneous displays by 48-bit LVDS/eDP+HDMI+DP
- 2 GbE, 4 USB3.1, CAN Bus, M.2 M-Key 2280 supports NVMe, DC-in 12-24V
- iManager & SW APIs, WISE-PaaS/DeviceOn
MIO-5393 (Product Data sheet)
- 9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/35W
- Dual channel DDR4-2400, up to 64GB, ECC for Xeon SKU
- Triple simultaneous displays with 48-bit LVDS+HDMI+DP
- USB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSD
- Dual GbE, SATAIII, RS-232/422/485, CANBus, SMBus, I2C
- M.2 B-Key 2280/3042, (optional M-Key 2280) & M.2 E-Key 2230
- Supports iManager 3.0 & SW APIs, WISE Paas/DeviceOn
Mini-ITX Motherboard
AIMB-276 (Product Data sheet)
- Supports 8th Generation Intel® Core™ i processor (LGA1151) with Intel Q370 chipset
- Two 260-pin SO-DIMM up to 32GB DDR4 2666 MHz SDRAM
- Supports triple display of Dual DP++/HDMI 2.0a/LVDS( or eDP)
- Supports PCIe x16 (Gen 3), 1 x M.2 B key + 1 x M.2 E key, 6 USB 3.1 & 4 USB 3.0, and 3 SATA III
- Supports wide range 12V~24V DC Input
- Supports Intel vPro, AMT 12.0, Software RAID 0,1,5,10, TPM 1.2 / 2.0 (optional)
AIMB-286 (Product Data sheet)
- Supports Intel® 8th Gen Core™ i processor (LGA1151) with Intel H310 chipset
- Two 260-pin SO-DIMM up to 32GB DDR4 2666 MHz SDRAM
- Supports PCIe x 4 (Gen 3), 1 M.2 B key, 1 M.2 E key, 4 USB 3.0 and 3 SATA III
- Supports dual display of DP/HDMI/LVDS(or eDP)
- Supports TPM 1.2 / 2.0 (optional)
- THIN Mini-ITX with 12V DC Input
MicroATX Motherboard
AIMB-506 (Product Data sheet)
- Supports Intel® 8th/9th Gen Core i7/i5/i3 processor with H310 chipset
- Supports up to 14 COM, 8 USB 3.0, 12 USB 2.0, TPM 1.2/2.0 (optional)
- Supports Dual display of VGA, DP, DVI, eDP, LVDS (optional) and two GbE LAN
- Two DIMM sockets support up to 64 GB DDR4 2666 MHz SDRAM
- Supports WISE PaaS/Device-On, McAfee, Acronis and Embedded Software APIs
AIMB-586 (Product Data sheet)
- Supports Intel® 8th Gen Xeon/ Core™ i7/i5/i3 processor with Q370/C246 chipset
- Four U-DIMM sockets support up to 64GB DDR4 2400/2666 MHz SDRAM
- Supports HDMI2.0a(option),2 DP++,eDP/LVDS(option) display
- Supports Intel AMT 12.0 and Intel vPro competent
- Supports PCIE Gen3, 4 USB3.1, 10 x USB2.0/USB 3.0, upto 4 x SATAIII and quad GbE LAN, M.2(M-key),M.2(E-key)
- Supports Software RAID 0, 1, 5, 10, TPM 1.2/2.0 (optional)
Embedded PC
EPC-C301 (Product Data sheet)
- Intel® 8th.Gen. Core Processor i7/i5 Fanless Embedded barebone system
- Semi-Industry Fanless slim systen, Din Rail or Wall mount design
- HDMI + DP* (Support vai MIO+) dual display
- 4 GbE, 4 USB3.1, 4 USB 2.0, CAN Bus, M.2 M-Key 2280 supports NVMe, M.2 E-key 2230, M.2 B-key, 1 full size of mini PCIe DC-in 12-24V
- -20 ~ 60 degree extend temperature operating
- iManager & SW APIs, WISE-PaaS/DeviceOn
EPC-T2286 (Product Data sheet)
- 1U with Intel® Desktop 8th Gen. Core i Processor
- Thin barebone with multi-IO ports is suitable for variety of application environments with DC-in design
- Support remote power jack, 6*COM, 8*USB
- One 2.5″ shock-resistant drive bay
- Easy/ quick installation for additional peripherals
- Support Wall/VESA/Rack mounting Kit
- Lock type DC power jack
Source: Advantech