ADLINK BOX PCS
ADLINKs revolutionäre Serie – Matrix Fanless Embedded Computer bietet den Kunden eine optimale Computerplattform mit erweiterbaren Optionen. Adlink Technology ist ein weltweiter Anbieter von Edge-Computing-Lösungen und NVIDIA Quadro Embedded Partner sowie Jetson Elite Partner. Gemeinsam bringen wir Edge-Computing in Verbindung mit GPU-Power auf das nächste Level.
- NVIDIA® Jetson™ TX2 Edge Inference Platform
- Deep learning acceleration with NVIDIA® Jetson™ TX2
- Compact fanless system 148(W)x105(D)x50(H)mm
- Wide temperature range from -20°C to 70°C
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor
- Dual SODIMMs for up to 32GB DDR4
- Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0
- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0
- Rich storage: up to 4 internal 2.5″ SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
- Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM
- Flexible modular expansion with 2 or 4 slots
- 6th Generation Intel® Core™ i7/i5/i3 Processors and QM170 chipset
- 2x DDR4 SO-DIMM sockets support up to 32GB memory
- 1x PCI and 2x PCIe Gen3 x8 (or 1x PCIe Gen3 x16) slots
- 2x Mini PCIe and 1x USIM slots
- Support for 3 independent displays with 2x DisplayPort and 1x DVI-I ports
- 3x Intel® GbE LAN ports with teaming function, Intel® iAMT 11.0
- 2x 2.5″ hot-swappable SATA III (6.0 Gb/s) trays on the front panel and 2x internal SATA III (6Gb/s) ports with RAID 0/1/5/10 support
- Remote power on/off switch connector on the front panel
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor
- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC
- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0
- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0
- Rich storage options: up to 4x 2.5″ SATA, M.2 2280
- Front accessible I/O and adaptive Function Module 2.0 options
- Flexible functionality expansion: Expansion slots for standard PCIe and PCI card, Embedded slots for Mini PCIe, M.2 3042, 2x USIM
- World leading embedded GP/GPU computing options built-in
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor
- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory
- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0
- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0
- Rich storage: up to 4x 2.5″ SATA, CFast, M.2 2280
- Embedded Expansion: Mini PCIe/ M.2 3042/ 2x USIM
- Front accessible I/O and adaptive Function Module v.2 option
- Flexible modular expansion with 2 or 4 slots
- 6th Gen Intel® Core™ i7/i5/i3 processors with H110/Q170 chipset
- Dual-channel DDR4 SO-DIMM sockets support up to 32GB memory
- Support for 2 independent displays with 1 VGA, 1 DVI and 2 DisplayPort
- MVP-6010: 1 PCIe Gen3 x16 and 3 PCI expansion slots
- MVP-6020: 2 PCIe Gen3 x8 and 2 PCI expansion slots
- 3 Intel® GbE ports with teaming function
- 2 software-programmable RS-232/422/485 + 2 RS-232 ports
- Extremely cost-effective, high performance Fanless system
- Support up to 65W CPU with fanless operation
- 6th Gen Intel® Core™ i7/i5/i3 processors and H110 chipset
- Dual-channel DDR4 SO-DIMM sockets support up to 32 GB memory
- Support for two independent displays with 1 VGA, 1 DVI, and 2 DisplayPort
- 1 PCIe Gen3 x16 and 1 PCI expansion slots
- 3 Intel® GbE ports with teaming function
- 2 software-programmable RS-232/422/485 + 2 RS-232 ports
- Front-accessible I/O for simplified installation and maintenance
- Extremely cost-effective, high performance fanless system
- Intel® Atom™ processor E3845 with 4C @1.91 GHz SoC
- 2x DDR3L SO-DIMM, supporting up to 8GB memory
- 2 PCI + 1 PCIe x4 or 3 PCI expansion slots
- Built-in dual-port isolated CAN and 16-CH isolated DI and DO
- 1 DisplayPort + 1 DVI-I
- 2 Intel GbE ports with teaming function, 1 USB 3.0 + 4 USB 2.0 portsÜ
- 2 software-programmable RS-232/422/485 + 2 RS-232 ports
- Built-in ADLINK SEMA 2.2 (Smart Embedded Management Agent)
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset
- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory
- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0
- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0
- Rich storage: 2x 2.5″ SATA 6 Gb/s, CFast, M.2 2280
- 9th Gen Intel® Core™ i7/i5/i3 LGA processor
- Dual SODIMMs sockets for up to 32GB DDR4
- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0
- 3x USB 3.1 Gen 1, 3x USB 2.0
- Rich storage options: 2x 2.5″ SATA, M.2 2280
- Intel® Celeron® QC N3160/DC N3060 SoC processor
- DDR3L 2x SODIMM up to 8GB
- 3x independent displays: DP, VGA (Optional LVDS or DP)
- Built-in ADLINK SEMA management solution
- 3x GbE, 2x RS-232/422/485, 2x RS-232, 4x DI/ 4x DO
- Pre-installed AI development component reduces testing and integration efforts thus accelerating time-to-market
- High product reliability guaranteed by well-validated power consumption, thermal design, and compatibility
- Optimized hardware design and performance tuning for AI vision applications
- Leverages up to 4x Intel® Movidius™ Myriad™ X VPUs to empower a wide variety of deep-learning applications
- Pre-installed AI development component reduces testing and integration efforts thus accelerating time-to-market
- High product reliability guaranteed by well-validated power consumption, thermal design, and compatibility
- Optimized hardware design and performance tuning for AI vision applications
- Widely supports the NVIDIA GPU portfolio to satisfy various deep- learning applications
Beratung & Support
Haben Sie noch weitere Fragen zu ADLINK Embedded Box PCs? Gerne stehen wir Ihnen bei Fragen zur Verfügung. Als deutschlandweit führender Systemintegrator betreuen wir unsere Kunden im Bereich der Embedded Box PCs individuell und finden schnell maßgeschneiderte Lösungen.
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