COMh-sdIL (NEW)

COM-HPC®/SERVER WITH INTEL® XEON® D-1700 PROCESSOR FAMILY

  • Com-hpc®/server with intel® xeon® d-1700 processor family
  • Size D “small” form factor – 120 x 160 mm
  • Intel Xeon D-1700 (formerly Ice Lake D) Server platform
  • Up to 10 cores, processor TDP up to 67W
  • 16x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
  • 8x LAN Ports for various configurations – up to 100GbE
  • Memory: Max 64GB soldered memeory with ECC support
  • Optional onboard storage NVMe
  • Industrial temperature versions
  • Embedded management controller

The COMh-sdIL is a compact COM-HPC® server module in “Size D small” (120 mm x 160 mm), surpassing conventional designs in resilience to shock and vibration. Boasting soldered components, it operates flawlessly in an extended temperature range (-40°C to +85°C), making it an ideal choice for outdoor applications.

Featuring 64 GB soldered DDR4 memory at 2933 MT/s and an optional soldered NVMe SSD with up to 1 TByte storage capacity, the COMh-sdIL ensures robust performance. With 32x PCIe lanes (16x PCIe Gen3 + 16x PCIe Gen4) and 2x Quad LAN interfaces supporting up to 100 Gbit Ethernet, it excels in high data throughput for demanding I/O and network structures.

Facilitating complex AI applications, high-performance networks, and edge applications in outdoor environments, the module incorporates Intel® AVX-512 for AI acceleration. Its balanced functionality in cores, memory, and LAN interfaces, ensures a reliable solution for the extended temperature range.

Alongside the COMh-sdIL, Kontron is developing a small-format COMh/Server Application Carrier and a plug-on Board Management Controller (BMC). These components collectively form a comprehensive system solution tailored for space-critical applications and harsh environmental conditions, ensuring long-term availability in the embedded market.

Beratung & Support zum COMh-sdIL

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