COMh-sdIL (NEW)

The COMh-sdIL is a compact COM-HPC® server module in “Size D small” (120 mm x 160 mm), surpassing conventional designs in resilience to shock and vibration. Boasting soldered components, it operates flawlessly in an extended temperature range (-40°C to +85°C), making it an ideal choice for outdoor applications.

Featuring 64 GB soldered DDR4 memory at 2933 MT/s and an optional soldered NVMe SSD with up to 1 TByte storage capacity, the COMh-sdIL ensures robust performance. With 32x PCIe lanes (16x PCIe Gen3 + 16x PCIe Gen4) and 2x Quad LAN interfaces supporting up to 100 Gbit Ethernet, it excels in high data throughput for demanding I/O and network structures.

Facilitating complex AI applications, high-performance networks, and edge applications in outdoor environments, the module incorporates Intel® AVX-512 for AI acceleration. Its balanced functionality in cores, memory, and LAN interfaces, ensures a reliable solution for the extended temperature range.

Alongside the COMh-sdIL, Kontron is developing a small-format COMh/Server Application Carrier and a plug-on Board Management Controller (BMC). These components collectively form a comprehensive system solution tailored for space-critical applications and harsh environmental conditions, ensuring long-term availability in the embedded market.