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COM HPC
COM-HPC® (Computer on Module for High Performance Computing) bietet als unabhängiger, neuer Standard eine evolutionäre Weiterentwicklung des bewährten Standards COM Express® für leistungshungrige Anwendungen. Mit COM HPC/Client und COM HPC/Server gibt es zwei Modultypen.
COM HPC/Client ist für die Verwendung in High-End-Embedded-Client-Produkten konzipiert, die ein oder mehrere Displays, I/Os mit niedriger, mittlerer und sehr hoher Bandbreite, leistungsstarke CPUs und eine geringe Größe erfordern.
COM HPC/Server deckt die Anforderungen beim Einsatz in High-End-Headless-Embedded-Servern (ohne Display) ab, die hohe CPU-Kapazität, große Speicherkapazität und viele I/O-Optionen mit hoher Bandbreite erfordern – bis hin zu mehreren 10-Gbit/s- oder 25-Gbit/s-Ethernet-Ports und 65 PCIe-Lanes mit Geschwindigkeiten bis zu PCIe Gen 5.
Als spezialisierter und unabhängiger Systemintegrator begleiten wir sie von der Produktauswahl bis zur Serie und stehen ihnen während des Produktlebenszyklus und darüber hinaus persönlich sowohl für ihre technischen als auch kaufmännischen Belange zur Verfügung.
COM HPC Client Type
Bei den COM-HPC/Client-Modulen wird es Varianten mit 95 x 120 mm, 120 x 120 mm und 160 x 120 mm geben. Sie sind für die neue Generation anspruchsvoller Applikationen im Embedded-Computing-Bereich konzipiert.
- Unterstützt bis zu vier Displays
- Bis zu 65 PCIe Lanes und 4 x USB 4.0
- Leistung bis 251 Watt Module Input Power für Prozessoren mit bis zu 100 Watt Verlustleistung
- Bis zu vier SO-DIMM-Sockel für bis zu 128 GByte Arbeitsspeicher
- Direkter Anschluss von Embedded-Kameramodulen über zwei MIPI-CSI Interfaces.
- Ethernet-Ports: bis zu zwei 25 GbE-KR und einmal BaseT bis zu 10 GbE
- Drei Größen: 120 mm x 160 mm (Size C), 120 mm x 120 mm (Size B), 120 mm x 95 mm (Size A).
- COM-HPC® Client Size A Module
- 14th Gen Intel® Core™ processors (Meteor Lake) CPU, Up to 14C/20T
- Intel Xe LPG graphic up to 128EU, 4 independent 4K display
- Dual-CH DDR5 5600MT/s up to 96GB SODIMM
- Multiple I/O expansion: 2.5GbE, PCIe Gen5, USB4 & USB3.2 Gen2, SATA3.0
- Support Dual BIOS for failsafe and flexible BIOS configuration
- Supports iManager, Embedded Software APIs and Wise-DeviceOn
- COM-HPC Client Type Size A Module with 13th Gen Intel® Core™ Processor
- Up to 64 GByte DDR5 memory
- Up to 2.5Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade
- COM-HPC Client Type Size A Module with 12th Gen Intel® Core™ Processor
- Up to 64 GByte DDR5 memory
- Up to 2.5Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions planned
- COM-HPC Client Type Size B Module with 12th Gen Intel® Core™ Processor
- Up to 14 cores, 20 threads
- Edge AI (VNNI, Intel® Iris® Xe)
- DDR5 up to 4800 MT/s
- 16 PCIe Gen4 lanes
- USB4/TBT4
- Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
- Up to 24 cores, 32 threads
- 16 PCIe Gen5 lanes, 8 PCIe Gen4 lanes
- Up to 128GB DDR5 SO-DIMM at 3200 MT/s
- 2x 2.5GbE LAN
- AI inferencing (AVX-512 VNNI, Intel® UHD)
- Extreme rugged operating temperature (option)
- COM-HPC Client Type Size C Module based on Intel® Alder Lake S processors family
- Up to 16 cores (TDP range: 35 W-65 W) & 24 threads
- Memory: Max 128 GByte DDR5 via 4x SODIMMs, ECC and non-ECC
- 16x PCIe Gen 5.0 lanes (for high performance CPUs) + 8x PCIe Gen 4.0 lanes +
- 6x PCIe Gen 3.0 lanes
- 3x DDI + 1x eDP
- COM-HPC® Client Size C Module
- Intel® Alder Lake-S desktop socket type CPU
- Up to 16 Cores, 24 Threads, 65W TDP
- Dual Channel DDR5 SODIMM, max. 128GB (Both ECC & Non-ECC)
- 16 PCIe Gen5 + 16 PCIe Gen4 + 10 PCIe Gen3 lanes
- Supports iManager, Embedded Software APIs, and WISE-DeviceOn
- PICMG COM-HPC Client pinout
- COM-HPC Size A, B and C compatible
- Rich extension: 1 x PCIe x16 (Gen5), 7 x PCIe x4 (Gen5)
- 3 x DDI outputs DP and 1 x eDP interfaces
- 10/25 Gigabit Ethernet support by OCP mezzanine card
- Visible Debug Utility: BIOS 80 Port and Power State
- COM-HPC® Client module Size A with 12th Gen Intel® Core™ (formerly Alder Lake – H series) Processors
- Available in Industrial Temperature Range
- Intel® Iris® Xe Architecture with up to 96 EUs, up to 4 independent displays
- 2x 2.5GbE; 4x USB4 Gen 2×2; 4x USB2.0; 8x PCIe x1 Gen3, 1x PCIe x8 or 2x PCIe x4 Gen4; Optional on-board WiFi 6E + BT 5.2
- Two DDR5 SO-DIMM Slots supporting DDR5-4800 Memory
- COM-HPC® Client module Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (formerly Tiger Lake-H) Processors for FuSa applications
- Available in Industrial Temperature Range
- 2x USB 4; 2x USB 3.2 Gen 2×2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; up to 2x 2.5GbE
- Two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory
- COM-HPC® Client module Size A with 11th Gen Intel® Core™ and Celeron® (formerly Tiger Lake-UP3) Processors
- Available in Industrial Temperature Range
- Intel® Iris Xe Graphics Core Gen12 GPU with up to 96 EU, up to 4 independent displays
- 4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3 ; 1x PCI-e x4 Gen4; up to 2x 2.5GbE
- Two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory
COM HPC Server Type
COM-HPC/Server-Module gibt es mit Abmessungen von 160 x 160 mm und bis zu vier DIMM-Steckplätzen oder 200 x 160 mm und bis zu acht DIMM-Steckplätzen. Wie der Name schon andeutet, werden damit COMs mit Performance-Werten klassischer IT-Server möglich.
- Edge-Server mit besonders hohen Performance-Anforderungen
- Leistung bis 358Watt Module Input Power für Prozessoren mit bis zu 150 Watt Verlustleistung
- Bis zu 65 PCIe Lanes
- 8 DIMM-Sockel für bis zu 1 TByte Arbeitsspeicher
- Ethernet-Ports: bis zu acht 25 GbE-KR und einmal BaseT bis zu 10 GbE
- Zwei Größen 160 mm x 160 mm (Size D und 200 mm x 160mm (Size E)
- Com-hpc®/server with Intel® Xeon® D-1700/D-1800 processor family
- Size D “small” form factor – 120 x 160 mm
- Intel Xeon D-1700 / D-1800 Server platform
- Up to 10 cores, processor TDP up to 67W
- 16x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
- 8x LAN Ports for various configurations – up to 100GbE
- Memory: Max 64GB soldered memeory with ECC support
- Optional onboard storage NVMe
- Industrial temperature versions
- Embedded management controller
- COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)
- Up to 20 cores, 30MB cache
- Edge AI (Intel® AVX-512 & VNNI)
- 8x 10G Ethernet
- 32 PCIe Gen4, 16 PCIe Gen3 lanes
- COM-HPC Server Type Size E Module with Ampere® Altra® SoC
- Up to 128 Arm-based cores at 190W TDP
- Up to 768GB DDR4 with 6 individual memory channels
- Open source EDK II, seamless support for popular OS, hypervisors and software
- 64 PCIe Gen4 lanes (3 x16 available)
- Dedicated PCIe and IPMB for remote management
- COM-HPC Server Type Size E Module with Ampere® Altra® SoC
- Up to 80 Arm-based cores at 175W TDP
- Up to 768GB DDR4 with 6 individual memory channels
- Arm SystemReady SR and EDK II, seamless support for popular OS, hypervisors and software
- 64 PCIe Gen4 lanes (3 x16 available)
- Dedicated PCIe and IPMB for remote management
- COM-HPC®/Server with Intel® Xeon® D-2700/D-2800 processor family
- Size D form factor – 160 x 160 mm
- Intel Xeon D-2700 / D-2800 Server platform
- Up to 20 cores, processor TDP up to 125W
- 32x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
- 8x LAN Ports for various configurations – up to 100GbE
- Memory: Max 512GB DDR4-DIMM with 4x DIMM sockets
- Optional onboard storage NVMe
- Industrial temperature versions
- Embedded management controller
- COM-HPC® Server Size D Module
- Intel® Xeon® D-2700 processors
- Up to 20 Cores, 30MB LLC Cache, 118W TDP
- Quad channel DDR4-3200 RDIMM/LRDIMM up to 512GB (Both ECC & Non-ECC)
- 32 x PCIe Gen 4, 17 x PCIe Gen 3, 4 x 25GBASE-KR, IPMB
- Supports iManager, Embedded Software APIs, and WISE-DeviceOn
- PICMG COM-HPC Server pinout
- COM-HPC Size D and E compatible
- Rich extension: 1 PCIe x16, 2 PCIe x8, 5 PCIe x4
- Integrated BMC supports VGA, Dedicated NIC for IPMI, iKVM
- 10/25 Gigabit Ethernet support by OCP mezzanine card
- Visible Debug Utility: BIOS 80 Port and Power State
- PICMG COM-HPC® Server pinout
- COM-HPC® Size E (Proprietary)
- Rich extension: 4 x PCIe x16, 1 PCIe x8, 1 PCIe x4, 2 PCIex1 (Gen 5)
- 1 PCIe x1 reserved for BMC add-in card
- Max. power 225W supplying for server grade processor
- Visible Debug Utility: BIOS 80 Port and Power State
- COM-HPC® Server Size E module with proprietary pinout
- Up to 64C/225W AMD EYPC™ 7003 real server grade CPU with extreme performance
- Up to 512GB large memory size with 4x DDR4 long DIMM
- 79 PCIe Gen4 lanes (14 more than COM-HPC STD)
- Supports iManager, Embedded Software APIs, WISE-DeviceOn, and IPMB
Evaluierungsboard
- Support of 48 PCIe lanes via various PCIe and m.2 slots
- 2x 10/1GBase-T interface
- 2x USB Gen 4 + 2x USB 3.2 Gen 2×1, 2x SATA
- 3x DisplayPort, 1x eDP, 2x MIPI-CSI
- BIOS POST-Code display
- COM-HPC Server Type Reference Carrier Board in Extended ATX Form Factor
- Three PCIe x16, two PCIe x4 slots and two M.2 slots
- Four USB 3.2, one generic Ethernet and VGA
- 10GbE adapter card in OCP form factor (optional)
- IPMI BMC and dedicated Ethernet for remote management
- Support of overall 65x PCIe lanes via various PCIe card connectors
- Support of overall 8x 10/25G Ethernet ports:
- 8x 10/25G Ethernet via integrated re-timer support to SFP28 cages
- 1x 10/1GBase-T interface
- 4x USB 3.1/0 Interface
- 2x SATA standard interfaces
- BMC expansion slot
- COM-HPC® Server Carrier for Size D and Size E Modules
- PICMG COM-HPC Server pinout
- COM-HPC Size D and E compatible
- Rich extension: 1 PCIe x16, 2 PCIe x8, 5 PCIe x4
- Integrated BMC supports VGA, Dedicated NIC for IPMI, iKVM
- 10/25 Gigabit Ethernet support by OCP mezzanine card
- Visible Debug Utility: BIOS 80 Port and Power State
- COM-HPC Server Carrier and Starter Kit
- COM-HPC Ampere Altra server type module with Ampere Altra 32/64/80-core SoC
- 32/64/128 GB 3200MHz DDR4 ECC Reg
- 3 x16 slots and 4 x4 slots PCIe Gen4
- 128 GB NVMe M.2 storage
- COM-HPC Server Base carrier board
- Liquid cooling assembly (optional)
- 750W power unit
- Tower enclosure
- COM-HPC Server Type Size E SOAFEE-enabled Reference Development Platform based on Ampere® Altra® SoC
- SOAFEE’s reference Arm development platform
- Ampere Altra SoC (Arm Neoverse N1 based architecture)
- 32/64/80 Arm v8.2 64-bit cores up to 2.8GHz
- IPMI BMC and dedicated Ethernet for remote management
- Arm SystemReady SR compliance, open source EDKII
Beratung & Support
Haben Sie noch weitere Fragen zu COM HPC? Gerne stehen wir Ihnen bei Fragen zur Verfügung. Als deutschlandweit führender Systemintegrator betreuen wir unsere Kunden im Bereich der COM HPC individuell und finden schnell maßgeschneiderte Lösungen.
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