COM HPC
COM-HPC® (Computer on Module for High Performance Computing), as an independent new module standard, offers an evolutionary further development of the proven COM Express® standard for power-hungry applications. With COM HPC/Client and COM HPC/Server, there are two module types.
COM HPC/Client is designed for use in high-end embedded client products that require one or more displays, with low-, medium-, and very high-bandwidth I/O, powerful CPUs, and small size.
COM HPC/Server covers the requirements when used in high-end headless (non-display) embedded servers that require high CPU capacity, large memory capacity, and many high-bandwidth I/O options – up to multiple 10 Gbps or 25 Gbps Ethernet ports and 65 PCIe lanes with speeds up to PCIe Gen 5.
As a specialized and independent system integrator, we accompany you from product selection to series production and are personally available for both your technical and commercial needs during the product lifecycle and beyond.
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Design Review
COM HPC Client Type
The COM-HPC/Client modules will be available in 95 x 120 mm, 120 x 120 mm and 160 x 120 mm versions. They are designed for the new generation of demanding applications in the embedded computing sector.
- Supports up to four displays
- Up to 65 PCIe lanes and 4 x USB 4.0
- Power up to 251 watts Module Input Power for processors with up to 100 watts power dissipation
- Up to four SO-DIMM sockets for up to 128 GByte memory
- Direct connection of embedded camera modules via two MIPI-CSI interfaces.
- Ethernet ports: up to two 25 GbE-KR and once BaseT up to 10 GbE
- Three sizes: 120 mm x 160 mm (Size C), 120 mm x 120 mm (Size B), 120 mm x 95 mm (Size A).
- COM-HPC Client Type Size A Module with 13th Gen Intel® Core™ Processor
- Up to 64 GByte DDR5 memory
- Up to 2.5Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade
- COM-HPC Client Type Size B Module with 12th Gen Intel® Core™ Processor
- Up to 14 cores, 20 threads
- Edge AI (VNNI, Intel® Iris® Xe)
- DDR5 up to 4800 MT/s
- 16 PCIe Gen4 lanes
- USB4/TBT4
- Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
- Up to 24 cores, 32 threads
- 16 PCIe Gen5 lanes, 8 PCIe Gen4 lanes
- Up to 128GB DDR5 SO-DIMM at 3200 MT/s
- 2x 2.5GbE LAN
- AI inferencing (AVX-512 VNNI, Intel® UHD)
- Extreme rugged operating temperature (option)
- COM-HPC Client Type Size C Module based on Intel® Alder Lake S processors family
- Up to 16 cores (TDP range: 35 W-65 W) & 24 threads
- Memory: Max 128 GByte DDR5 via 4x SODIMMs, ECC and non-ECC
- 16x PCIe Gen 5.0 lanes (for high performance CPUs) + 8x PCIe Gen 4.0 lanes +
- 6x PCIe Gen 3.0 lanes
- 3x DDI + 1x eDP
- COM-HPC® Client module Size A with 12th Gen Intel® Core™ (formerly Alder Lake – H series) Processors
- Available in Industrial Temperature Range
- Intel® Iris® Xe Architecture with up to 96 EUs, up to 4 independent displays
- 2x 2.5GbE; 4x USB4 Gen 2×2; 4x USB2.0; 8x PCIe x1 Gen3, 1x PCIe x8 or 2x PCIe x4 Gen4; Optional on-board WiFi 6E + BT 5.2
- Two DDR5 SO-DIMM Slots supporting DDR5-4800 Memory
- COM-HPC® Client module Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (formerly Tiger Lake-H) Processors for FuSa applications
- Available in Industrial Temperature Range
- 2x USB 4; 2x USB 3.2 Gen 2×2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; up to 2x 2.5GbE
- Two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory
- COM-HPC® Client module Size A with 11th Gen Intel® Core™ and Celeron® (formerly Tiger Lake-UP3) Processors
- Available in Industrial Temperature Range
- Intel® Iris Xe Graphics Core Gen12 GPU with up to 96 EU, up to 4 independent displays
- 4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3 ; 1x PCI-e x4 Gen4; up to 2x 2.5GbE
- Two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory
COM HPC Server Type
COM-HPC/Server modules are available with dimensions of 160 x 160 mm and up to four DIMM slots or 200 x 160 mm and up to eight DIMM slots. As the name suggests, this enables COMs with performance values of classic IT servers.
- Edge servers with particularly high performance requirements
- Performance up to 358 Watt Module Input
- Power for processors with up to 150 Watt power dissipation
- Up to 65 PCIe lanes
8 DIMM sockets for up to 1 TByte memory - Ethernet ports: up to eight 25 GbE-KR and once BaseT up to 10 GbE
- Two sizes 160 mm x 160 mm (Size D and 200 mm x 160mm (Size E)
- Com-hpc®/server with intel® xeon® d-1700 processor family
- Size D “small” form factor – 120 x 160 mm
- Intel Xeon D-1700 (formerly Ice Lake D) Server platform
- Up to 10 cores, processor TDP up to 67W
- 16x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
- 8x LAN Ports for various configurations – up to 100GbE
- Memory: Max 64GB soldered memeory with ECC support
- Optional onboard storage NVMe
- Industrial temperature versions
- Embedded management controller
- COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)
- Up to 20 cores, 30MB cache
- Edge AI (Intel® AVX-512 & VNNI)
- 8x 10G Ethernet
- 32 PCIe Gen4, 16 PCIe Gen3 lanes
- COM-HPC Server Type Size E Module with Ampere® Altra® SoC
- Up to 80 Arm-based cores at 175W TDP
- Up to 768GB DDR4 with 6 individual memory channels
- Arm SystemReady SR and EDK II, seamless support for popular OS, hypervisors and software
- 64 PCIe Gen4 lanes (3 x16 available)
- Dedicated PCIe and IPMB for remote management
- Size D form factor – 160 x 160 mm
- Intel Xeon D-2700 (formerly Ice Lake D) Server platform
- Up to 20 cores, processor TDP up to 125W
- 32x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
- Up to 8x LAN Ports for various configurations: 100GbE / 2x 50GbE / 4x 25GbE + 4x 10GbE
- Memory: Max 512GB DDR4-DIMM with 4x DIMM sockets
- Optional onboard storage NVMe
- Industrial temperature versions
- Embedded management controller
- COM-HPC® Server Size D Module
- Intel® Xeon® D-2700 processors
- Up to 20 Cores, 30MB LLC Cache, 118W TDP
- Quad channel DDR4-3200 RDIMM/LRDIMM up to 512GB (Both ECC & Non-ECC)
- 32 x PCIe Gen 4, 17 x PCIe Gen 3, 4 x 25GBASE-KR, IPMB
- Supports iManager, Embedded Software APIs, and WISE-DeviceOn
- COM-HPC® Server Size E module with proprietary pinout
- Up to 64C/225W AMD EYPC™ 7003 real server grade CPU with extreme performance
- Up to 512GB large memory size with 4x DDR4 long DIMM
- 79 PCIe Gen4 lanes (14 more than COM-HPC STD)
- Supports iManager, Embedded Software APIs, WISE-DeviceOn, and IPMB
Evaluation Boards
- COM-HPC Server Type Reference Carrier Board in Extended ATX Form Factor
- Three PCIe x16, two PCIe x4 slots and two M.2 slots
- Four USB 3.2, one generic Ethernet and VGA
- 10GbE adapter card in OCP form factor (optional)
- IPMI BMC and dedicated Ethernet for remote management
- Support of overall 65x PCIe lanes via various PCIe card connectors
- Support of overall 8x 10/25G Ethernet ports:
- 8x 10/25G Ethernet via integrated re-timer support to SFP28 cages
- 1x 10/1GBase-T interface
- 4x USB 3.1/0 Interface
- 2x SATA standard interfaces
- BMC expansion slot
- COM-HPC® Server Carrier for Size D and Size E Modules
- PICMG COM-HPC Server pinout
- COM-HPC Size D and E compatible
- Rich extension: 1 PCIe x16, 2 PCIe x8, 5 PCIe x4
- Integrated BMC supports VGA, Dedicated NIC for IPMI, iKVM
- 10/25 Gigabit Ethernet support by OCP mezzanine card
- Visible Debug Utility: BIOS 80 Port and Power State
- COM-HPC Server Carrier and Starter Kit
- COM-HPC Ampere Altra server type module with Ampere Altra 32/64/80-core SoC
- 32/64/128 GB 3200MHz DDR4 ECC Reg
- 3 x16 slots and 4 x4 slots PCIe Gen4
- 128 GB NVMe M.2 storage
- COM-HPC Server Base carrier board
- Liquid cooling assembly (optional)
- 750W power unit
- Tower enclosure
Consulting & Support
Do you have any further questions about COM HPC? We will be happy to answer any questions you may have. As Germany’s leading system integrator, we provide our customers with individual support in the area of COM HPC and can quickly find customized solutions.
Together with our technology partners, we find the best embedded solutions in the area of COM HPC. Contact us directly now!