COMe
COM Express® ist der Industriestandard seit mittlerweile mehr als 15 Jahren. Mit 3 unterschiedlichen Formfaktoren (mini, compact, basic) stehen für jeden Anwendungsfall passende Performanceklassen zur Verfügung.
- Bewährter Industriestandard für x86-Prozessoren
- Dre aktuelle Pinout-Typen
- COM Express Type 6
- COM Express Type 7
- COM Express Type 10
- Drei Formfaktoren
- Basic (125 x 95 mm) für mobile CPUs (Intel® Core™ oder AMD-Ryzen-CPUs)
- Compact (95 x 95 mm) für performantere aber stromsparende Plattformen (z.B. CPUs der Intel-U-Serien oder AMD Ryzen)
- Mini (55 x 84 mm) für mobile Anwendung im unteren Performancebereich (Intel® Atom™) mit wenig Platz
- AMD Ryzen Embedded 8000 COM Express® Compact Type 6 Module
- COM Express® R3.1 Compact Module Type 6 Pinout
- AMD RYZEN Embedded 8000, Hi-Performance Zen4 CPU up to 8C / 16T
- AMD Radeon RDNA3 Graphics, 4 independent 4K displays
- AMD XDNA NPU, 16 TOPS
- Dual Channels DDR5 SO-DIMM Sockets, Up to 96GB RAM
- High Speed I/Os: 2.5GbE, PCIe Gen 4, USB 3.2 Gen2, SATA3.0
- Supports iManager, Embedded Software APIs and WISE-DeviceOn
- Intel® Core™ i3, N series and Atom® x7000 Series Processors (Alder Lake-N/Amston Lake) COM Express® Compact Type 6 Module
- COM Express® R3.1 Compact Module Type 6 Pinout
- Intel® Core™ i3, N series and Atom® x7000 Series Processors
- Single-CH DDR5 4800MT/s up to 16GB, support IBECC
- PCIe gen3, USB3.2 Gen2, SATA3.0, 2.5GbE support TSN
- On board eMMC (Option)
- Supports iManager, Embedded Software APIs and Wise-DeviceOn
- Intel® 8th Gen Core Processors COM Express Compact Module R3.0 Type6
- On board storage eMMC up to 64GB, TPM2.0
- High speed I/O: 4 USB3.1 (Gen2), 6 PCIe X1 (Gen3), 4 SATA (Gen3)
- Intel® 8th Gen Core Processors Product Family with Dual channel DDR4 Max 32GB memory
- Intel® 14th Gen Core Processors (Code Name: Meteor Lake-U/H) COM Express Basic Type 6 Module
- COM Express® R3.1 Basic Module Type 6 Pinout
- Intel® 14th Gen Core Processors , Up to 14C/20T
- Intel Xe LPG graphic up to 128EU, 4 independent 4K display
- Dual-CH DDR5 5600MT/s up to 96GB SOMDIMM
- Multiple I/O expansion: 2.5GbE, PCIe gen4, USB4 & USB3.2 Gen2, SATA3.0
- Support Dual BIOS failsafe
- Supports iManager, Embedded Software APIs and Wise-DeviceOn
- 13th Generation Intel® Core™ Processor
- COM Express R3.1 Compact Module Type 6 Pinout
- Dual channel memory up to 64GB, 4800MT/s
- High speed I/O: 16x PCIe Gen4, 8x PCIe Gen3, 2x USB4 & 4x USB3.2 Gen2
- Supports SUSI, DeviceOn and Edge AI Suite
- COM Express® Basic Type 6 with Intel® Core™ Ultra Meteor Lake-H/U series
- Intel® Arc™ Graphics architecture with up to 8 Xᵉ-Cores (128EUs)
- Integrated NPU for dedicated AI acceleration
- Up to 96 GByte DDR5 memory
- Up to 2.5 Gb Ethernet
- Optional NVMe SSDs onboard
- COM Express® Basic Type 6 mit 13th Generation Intel® Core™ Processors
- Up to 64 GByte DDR5 memory
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- COM Express® Basic Type 6 with 11th Generation Intel® Core™ / Xeon® Processors
- Up to 128 GByte DDR4 memory
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
- Additional Real time / Industrial SKUs (14C/20T)
- Up to 64GB DDR5 SO-DIMM at 4800 MT/s, IBECC
- AI inferencing (AVX-512 VNNI, Intel® Iris® Xe)
- PCIe Gen4, 4x displays / 2x USB4
- Extreme rugged operating temperature (option)
- COM Express® 3.1 Type 6 Basic Module with 13th Gen Intel® Processors (Raptor Lake-P)
- Embedded Intel® Iris® Xe graphics with up to 96 execution units
- 1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen 2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4
- Two DDR5 SO-DIMM Slots supporting DDR5-4800 IBECC Memory, up to 64GB
- COM Express® Basic Type 6 with 8th/9th Generation Intel® Core™ / Xeon® Processors
- Up to 128 GByte DDR4 non-ECC/ECC memory
- Optional NVMe SSD onboard
- Industrial grade versions
- Support of Kontron’s Embedded Security Solution (APPROTECT)
- COM Express® Compact Type 6 with 7th generation Intel® Core™ processors
- Intel® 7th Generation Core™ series / Xeon® E3 v6 family with CM238/QM175 PCH
- Up to 32 GByte DDR4 non-ECC/ECC memory
- Three independent displays with up to 4k@60Hz resolution
- TPM2.0 and built in Hardware Security Device
- Support of Intel® Optane™ memory technology via PCIe
- Industrial grade versions
- Intel® Atom™ C3000 Processor COM Express R3.0 Type 7 Module
- 2~16 core processor, with max. TDP 31W
- Dual-CH DDR4 2400 w/ECC, max. 128GB
- High speed Ethernet (4 10GBASE-KR interfaces, one GbE)
- Abundant expansion: (3 PCIex4, 1 GbE, 2 SATA 3.0, 4 USB 3.0)
- Supports iManager, Embedded Software APIs and Wise-PaaS/RMM
- COM Express® basic Type 7 with Intel® Atom® processor C3000 product family
- Entry level server-grade platform
- Quad 10 GbE interfaces
- High-speed connectivity PCIe 3.0, SATA3, USB 3.0
- Up to 128GB DDR4 memory
- Industrial grade versions
- Server-grade platform based on Intel® Xeon® D-1700 / D-1800 processor family
- Quad 10 GbE interfaces
- High-speed connectivity 16x PCIe 4.0 + 16x PCIe 3.0, SATA, USB 3.0
- Up to 1 TByte NVMe SSD onboard
- Industrial grade versions
- COM Express® basic Type 7 with Intel® Xeon® and Pentium® processor D-1500 SoC
- Dual 10 GbE interfaces
- High-speed connectivity x24 PCIe 3.0 + x8 PCIe 2.0, SATA3, USB 3.0
- Industrial grade versions
- COM EXPRESS® Basic V2000 with AMD Embedded V-series High-Performance „ZEN2“ CPU
- Up to 64 GByte DDR4 memory (2x 32 GByte dual-channel DDR4 SO-DIMM)
- Up to 8 PCIe lanes (4x PCIe 3.0 (up to 8 GT/s) 4x PCIe 2.0 (up to 5 GT/s))
- Optional up to 1 TByte NVMe SSD onboard
- Industrial grade versions available
- COM EXPRESS® Basic Type 7 with AMD Epyc Embedded 3000 SoC Processsors
- Supports Single-Die SP4r2 (up to 8 cores) and Dual-Die SP4 (up to 16 core) processors
- Quad 10GbE interfaces
- 4 x SODIMM sockets (up to 128GB DDR4 memory) on request
- Industrial grade versions
- COM Express Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor (formerly codename: Ice Lake-D)
- Up to 10 cores, 15MB cache
- Edge AI (Intel® AVX-512 & VNNI)
- 4x 10G Ethernet
- 16 PCIe Gen4, 16 PCIe Gen3 lanes
- Industrial-grade reliability
- COM Express Rev. 3.1 Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor
- Up to 14 cores, 20 threads
- Edge AI (VNNI, Intel® Iris® Xe)
- DDR5 up to 4800 MT/s
- 16 PCIe Gen4 lanes
- USB4/TBT4
- COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
- Intel® Tiger Lake-H Processors (up to 8 cores) integrated with Intel® UHD Graphics (Xe architecture)
- AI inference (AVX512 VNNI + Intel® UHD GFX)
- Up to 128GB DDR4 SO-DIMM, non-ECC, ECC
- 3x DDI channels, 1x LVDS (opt. 4 lane eDP), opt. VGA, up to 4 independent displays
- PCIe x16 Gen4, 2.5GbE (TSN, build option)
- Extreme Rugged operating temperature: -40°C to +85°C (build option, selected SKUs)
- COM Express® Compact Type 6 with Intel® Atom® X7000E/X7000RE
- Low-Power – Performance/Watt optimized form factor solution
- Up to 16 GByte DDR5 4800 MT/s – In-Band ECC
- Up to 4x Graphics interfaces
- Up to 6x PCIe lanes, up to 4x USB 3.2/2.0, 6x USB 2.0
- Up to 2.5 Gb Ethernet with TSN support
- Industrial grade temperature
- COM Express® Compact Type 6 with 13th Generation Intel® Core™ Processors
- Up to 64 GByte LPDDR5 memory down
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- COM Express® Compact Type 6 with 12th Generation Intel® Core™ Processors
- Up to 64 GByte LPDDR5 memory
- Up to 2.5Gb Ethernet with TSN and WOL support
- Quad Independent Display Support (up to 8k)
- Optional NVMe SSD onboard
- COM Express® Compact Type 6 with 11th Generation Intel® Core™ Processors
- Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- COM Express® Compact Type 6 with 8th Generation Intel® Core™ / Celeron® Processors
- Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
- Optional NVMe SSD onboard
- Industrial grade versions
- Kontron APPROTECT security solution based on Wibu-Systems CodeMeter®
- COM Express® compact pin-out type 6 Computer-on-Module with 7th Generation Intel® Core™ Processors
- Up to 24 GByte DDR4 memory (8 GByte DDR4 memory down)
- three independent displays with up to 4k@60Hz resolution
- Up to 10 lanes PCIe 3.0
- 4x USB 3.0, 2x SATA 6G
- TPM2.0 and built-in Hardware Security Device
- COM Express® compact Type 7 with Intel® Atom® processor C3000 product family
- Entry level space-optimized server-grade platform
- Quad 10 GbE interfaces
- High-speed connectivity PCIe 3.0, SATA3, USB 3.0
- Up to 64GB DDR4 memory
- Industrial grade versions
- Support of Kontron’s Embedded Security Solution – APPROTECT
- COM Express® compact Type 6 with Intel Atom® x6000E, Pentium® and Celeron® Series
- Low-power – performance/watt optimized form factor solution
- Up to 32 GByte DDR4-3200 Memory via 2x SODIMM sockets (In-Band ECC)
- Triple display support
- 6x PCIe 3.0 lanes
- Up to 4x USB 3.1/2.0, 4x USB 2.0, 2x SATA, eMMC Flash
- TSN Support
- Industrial grade temperature
- COM Express® compact Type 6 with Intel® Atom™ E3900 Series, Pentium® and Celeron® Processors
- Low-power – performance/watt optimized form factor solution
- Up to 8 GByte DDR3L 1600 / 1867 Memory (2x SODIMM socket)
- Triple display support
- Up to 5x PCIe lanes
- 4x USB 3.0/2.0, 4x USB 2.0, 2x SATA, eMMC Flash
- Industrial grade temperature
- COM EXPRESS® Compact Type 6 with AMD Ryzen™ Embedded V/R1000 Series APUs
- Leading graphics performance
- Up to 4 independent display support
- Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
- Industrial grade versions
- Support of Kontron’s Embedded Security Solution (Approtect)
- COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors
- PCIe Gen4 and PCIe Gen3 lanes
- AI inference (VNNI + Iris Xe graphics)
- 2.5GbE Ethernet, with optional TSN
- In-Band ECC error correction
- COM Express Compact Size Type 6 Module with Intel Atom® x6000E Processor SoC (formerly codename: Elkhart Lake)
- In-Band ECC error correction
- 2.5GbE Ethernet, with optional TSN
- PCIe Gen3 lanes, USB 3.2 10Gbps
- 3x 4K display
- Real Time I/O (GPIO, UART, I2C)
- COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)
- Up to 8 cores based on AMD Zen 2 architecture
- Improved graphics performance (new Radeon Vega GPU)
- Up to 4x 4K displays (DP, eDP)
- 2.5GbE Ethernet, up to 16 PCIe Gen3 lanes
- Configurable TDP down to 10W (8, 6 cores)
- COM Express® Compact Size Type 2 Module with Intel Atom® E3800 Series or Intel® Celeron® Processor SoC (formerly codename: Bay Trail)
- VGA and dual channel 18/24-bit LVDS
- Up to 8GB Dual Channel DDR3L at 1333MHz
- Single, dual, Quad-core Intel Atom® E3800 Series or Celeron® Processor SoC
- Two PCIe x1, and 32-bit PCI bus
- GbE, one SATA 3Gb/s, one PATA IDE, seven USB 2.0
- Supports Smart Embedded Management Agent (SEMA®) functions
- ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
- Intel Atom® E3800 Series SoC and Celeron® N2930/J1900 Processor
- Up to 8 GB non-ECC DDR3L at 1333 MHz
- Dual channel 24-bit LVDS and VGA
- 2x SATA or 2x PATA (Master only), 4x USB 2.0, 10/100 Mbps LAN (GbE via onboard connector)
- Extreme Rugged operating temperature: -40° to +85° (opt.)
- Supports Smart Embedded Management Agent (SEMA) functions
- COM Express® mini Type 10 with Intel Atom® X7000E / X7000RE series
- Low-Power – Performance/Watt optimized form factor solution
- Up to 16 GByte LPDDR5 memory down (In-Band ECC)
- 2x USB 3.2 Gen2/2.0, 6x USB 2.0
- 1 GbE (optional 2.5 GbE) with TSN support
- Industrial grade temperature
- COM Express® mini Type 10 with 13th generation Intel® Core™/Pentium® processors
- Up to 32 GByte LPDDR5(x) memory down
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- COM Express® mini Type 10 with Intel Atom® x6000E, Pentium® and Celeron® Series
- Low-Power – Performance/Watt optimized form factor solution
- Up to 16 GByte LPDDR4 memory down (In-Band ECC)
- 2x USB 3.1/2.0, 6x USB 2.0, USB client optional, 2x SATA, eMMC Flash
- TSN support
- Industrial grade temperature
- COM Express® mini Type 10 with Intel® Atom® E3900, Pentium® and Celeron® Processor Series
- Low-Power – Performance / Watt optimized small form factor solution
- Up to 8 GByte DDR3L memory down (ECC / non ECC)
- 2x USB 3.0/2.0, 6x USB 2.0, 2x SATA, eMMC Flash
- Industrial grade temperature
- Support of Kontron’s Embedded Security Solution – APPROTECT (optional)
- COM Express® mini Type 10 with Intel® Atom® E3900, Pentium® and Celeron® Processor Series
- Low-Power – Performance / Watt optimized small form factor solution
- Up to 16 GByte DDR3L memory down (non ECC)
- 2x USB 3.0/2.0, 6x USB 2.0, 2x SATA, eMMC Flash
- Industrial grade temperature
- Support of Kontron’s Embedded Security Solution – APPROTECT (optional)
- COM Express® mini Type 10 with Intel® Atom™ E3800 & Celeron® Series
- Up to 4GB DDR3L memory down (ECC optional)
- 1x USB 3.0, up to 7x USB 2.0, 1x USB client (optional), eMMC Flash, 2x SATA, SD-Card
- Commercial & Industrial Grade Temperature
- Intel® 11th Gen Core Processors, up to 8Core/16T, L3 Cache 24M
- Intel Iris Xe(Gen 12) graphics, 4 independent 4K display
- Dual channel DDR4 Max 128GB SODIMM, support ECC
- Super speed I/O: PCIe4 x16 (16GT/s), USB3.2 gen3 (10Gb), 2.5GbE(w/TSN), SATA3 (6Gb)
- TPM2.0 security protection, onboard NVMe SSD fast & anti-vibration
- Supports iManager, Edge-AI Suite, DeviceOn
- Intel® Xeon® D-1700 Processors
- COM Express R3.0 Basic Module Type 7 pin out
- 4~10 core processor, with max. TDP 67W
- High speed Ethernet (4 x 10GBASE-KR interfaces, one GbE)
- Various expansion (PCIe x16 Gen4, PCIe X8, 4PCIe X1, 4 USB3.0, 2 SATA3)
- Supports SUSI, DeviceOn and Edge AI Suite
- Intel® Xeon® Processor D-1500 Product Family COM Express® SOM-5992 Basic Module Type 7
- Up to 16 cores with 45W thermal design power
- Dual DDR4 ECC 2400, 1.2V Low Power Memory, Max. 64GB
- 1 PCIe x16, 1 PCIe x8, 8 PCIe x1, 2 x 10GBASE-KR interface
- COM Express R3.0 Basic Module Type 7 pin out
- Intel® Xeon® Processor D-1500 Product Family
- Solder-down Memory and SSD w/ ECC
- High speed Ethernet (dual 10GBASE-KR interfaces, one GbE)
- Abundant expansion. (PCIe x16, PCIe x8, 8 PCIe x1)
- Supports iManager, WISE-PaaS/DeviceOn and embedded software APIs
- 9th/8th Gen Intel Xeon/Core Processors COM Express Basic Module Type 6
- 3* DDI (digital display interface) 4k resolution
- 4* USB3.1 Gen 2 (10Gbps) / PEG x16 & 8* PCIe Gen3 (8Gbps)
- 6C CPU with 96GB large memory capacity
- 7th Gen Intel Core/Celeron Processors COM Express Basic Module Type 6
- Dual channel DDR4 2400, Max 32GB (ECC optional)
- Support Three independent symmetrical displays (up to 4K)
- Flexible I/O support: Gen3 PEG and PCIe, USB3.0 and SATA3
- AMD Ryzen Embedded V1000 COM Express Basic Module Type 6
- Dual channel DDR4, Max 32GB (Both ECC & Non-ECC)
- Supports Quad independent symmetrical displays (4 4K Displays)
- Rich IO Interfaces-2 SATA, 2 USB 3.1 Gen2, 1 USB 3.1 Gen1, 8 USB 2.0, 2 COM, TPM
- Supports iManager, WISE-PaaS/RMM and Embedded Software APIs
- 11th Generation Intel® Core™ Processor U-Series
- COM Express R3.0 Compact Module Type 6 Pinout
- Dual channel with one memory down and one SODIMM
- High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2
- Onboard NVMe x4 SSD up to 64GB, TPM2.0
- Supports iManager, Embedded Software APIs and WISE-DeviceOn
- COM Express® R3.0 Compact Module Type 6 Pinout
- Intel® Pentium®/Celeron® and Atom® x6000 Series (Elkhart Lake) Processors
- Dual Channel up to 32GB DDR4-3200 and IBECC Supported by Specific SKUs
- Supports up to 3 simultaneous display: LVDS/eDP, HDMI/DisplayPort
- Supports onboard eMMC Storage and 2.5GbE
- Supports iManager, WISE-DeviceOn, and Embedded Software APIs
- Intel® Pentium® N4200, Celeron® N3350, and Atom® E3900 Series COM Express Compact Module Type 6
- 8GB, dual Channel 1866 DDR3L memory (A1: non-ECC ; B1: ECC)
- Supports up to 3 simultaneous display: LVDS/eDP, VGA, HDMI/DisplayPort
- Supports H.264/AVC, H.265/HEVC, VP9, VP8 HW DECODE
- Supports Wide-range opreating temp./wide range power input 4.75 ~ 20 V
- AMD Embedded Ryzen 7nm SoC – V2000 APU
- COM Express® R3.0 Compact Module Type 6 Pinout
- Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC)
- High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0
- Four Display (DP++, HDMI, VGA, LVDS)
- Supports iManager, Embedded Software APIs and WISE-DeviceOn
- COMe Mini Type-10
- Intel® Tiger Lake UP3 processors
- 16GB LPDDR4X 4266MT/s and IBECC support
- USB4 Compliance supported by carrier board design
- NVMe SSD onboard
- Operating temperatures: Standard 0 ~ 60 °C (32 ~140 °F) or Extended -40 ~ 85 °C (-40 ~ 185 °F)
- COM R.2.1 Type 10 Mini Module
- Intel® Atom™/Celeron® processor for Intelligent systems
- Onboard DDR3L and SSD
- 4.75 ~ 20 V wide-voltage input support
- Embedded Software APIs and Utilities supported
- COM R.2.1 Type 10 Mini Module
- Intel® Atom™ E3900 & Pentium® / Celeron® Processor
- Max 8GB DDR3L onboard memory (support ECC, E3900 SKU only)
- Dual Display: LVDS, HDMI/DisplayPort
- onboard eMMC(default 32GB), TPM2.0
- Supports H.264/AVC, H.265/HEVC, VP9, VP8 HW DECODE
- Supports Wide-range operating temp./Wide range power input 4.75 ~ 20 V
- iManager and Embedded Software APIs
- Intel® Core™ i3, N series and Atom® x7000 Series Processors (Alder Lake-N/Amston Lake) COM Express® Mini Type 10 Module
- COM Express® R3.1 Mini Module Type 10 Pinout
- Intel® Core™ i3, N series and Atom® x7000 Series Processors
- Single-CH LPDDR5 4800MT/s up to 16GB, support IBECC
- 2.5GbE support TSN
- Multiple I/O expansion: PCIe gen3, USB3.2 Gen2, SATA3.0
- On board eMMC (Optional)
- Supports iManager, Embedded Software APIs and Wise-DeviceOn
- COM Express Mini Size Type 10 Module with Intel Atom® x6000 Processors
- LPDDR4 with in-band ECC error correction
- TCC and 2.5GbE with optional TSN
- PCIe Gen3 lanes, USB 3.2 10Gbps
- Real-time I/O (GPIO, UART, I2C)
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