COMe
COM Express® has been the industry standard for more than 15 years. With 3 different form factors (mini, compact, basic), suitable performance classes are available for every application.
- Proven industry standard for x86 processors
- Three current pinout types
- COM Express Type 6
- COM Express Type 7
- COM Express Type 10
- Three form factors
- Basic (125 x 95 mm) for mobile CPUs (Intel® Core™ or AMD-Ryzen-CPUs)
- Compact (95 x 95 mm) for more powerful but power-saving platforms (E.g. CPUs of the Intel U-series or AMD Ryzen)
- Mini (55 x 84 mm) for mobile application in the lower performance range (Intel® Atom™) with little space
- COM Express® Basic Type 6 mit 13th Generation Intel® Core™ Processors
- Up to 64 GByte DDR5 memory
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- COM Express® Basic Type 6 with 11th Generation Intel® Core™ / Xeon® Processors
- New microarchitecture with up to 8 cores
- Intel® XeGraphics with 4 independent displays (up to 8K)
- Support for up to 96GBytes of DDR4 -3200 memory
- Up to 2.5Gb Ethernet with TSN support
- Up to 1 TByte NVMe SSD onboard
- COM Express® basic Type 7 with Intel® Xeon® D-1700 processor family
- Server-grade platform
- Quad 10 GbE interfaces
- High-speed connectivity 16x PCIe 4.0 + 16x PCIe 3.0, SATA, USB 3.0
- Up to 1 TByte NVMe SSD onboard
- Industrial grade versions
- COM EXPRESS® Basic V2000 with AMD Embedded V-series High-Performance “ZEN2” CPU
- Up to 64 GByte DDR4 memory (2x 32 GByte dual-channel DDR4 SO-DIMM)
- Up to 8 PCIe lanes (4x PCIe 3.0 (up to 8 GT/s) 4x PCIe 2.0 (up to 5 GT/s))
- Optional up to 1 TByte NVMe SSD onboard
- Industrial grade versions available
- COM EXPRESS® Basic Type 7 with AMD Epyc Embedded 3000 SoC Processsors
- Supports Single-Die SP4r2 (up to 8 cores) and Dual-Die SP4 (up to 16 core) processors
- Quad 10GbE interfaces
- 4 x SODIMM sockets (up to 128GB DDR4 memory) on request
- Industrial grade versions
- COM Express Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor (formerly codename: Ice Lake-D)
- Up to 10 cores, 15MB cache
- Edge AI (Intel® AVX-512 & VNNI)
- 4x 10G Ethernet
- 16 PCIe Gen4, 16 PCIe Gen3 lanes
- Industrial-grade reliability
- COM Express® Compact Type 6 with 13th Generation Intel® Core™ Processors
- Up to 64 GByte LPDDR5 memory down
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
COMe-cTL6 (E2) (NEW)
- COM Express® Compact Type 6 with 11th Generation Intel® Core™ Processors
- Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- COM Express® compact Type 7 with Intel® Atom® processor C3000 product family
- Entry level space-optimized server-grade platform
- Quad 10 GbE interfaces
- High-speed connectivity PCIe 3.0, SATA3, USB 3.0
- Up to 64GB DDR4 memory
- Industrial grade versions
- Support of Kontron’s Embedded Security Solution – APPROTECT
- COM Express® compact Type 6 with Intel Atom® x6000E, Pentium® and Celeron® Series
- Low-power – performance/watt optimized form factor solution
- Up to 32 GByte DDR4-3200 Memory via 2x SODIMM sockets (In-Band ECC)
- Triple display support
- 6x PCIe 3.0 lanes
- Up to 4x USB 3.1/2.0, 4x USB 2.0, 2x SATA, eMMC Flash
- TSN Support
- Industrial grade temperature
- COM Express® compact Type 6 with Intel® Atom™ E3900 Series, Pentium® and Celeron® Processors
- Low-power – performance/watt optimized form factor solution
- Up to 8 GByte DDR3L 1600 / 1867 Memory (2x SODIMM socket)
- Triple display support
- Up to 5x PCIe lanes
- 4x USB 3.0/2.0, 4x USB 2.0, 2x SATA, eMMC Flash
- Industrial grade temperature
- COM EXPRESS® Compact Type 6 with AMD Ryzen™ Embedded V/R1000 Series APUs
- Leading graphics performance
- Up to 4 independent display support
- Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
- Industrial grade versions
- Support of Kontron’s Embedded Security Solution (Approtect)
- COM Express® mini Type 10 with 13th generation Intel® Core™/Pentium® processors
- Up to 32 GByte LPDDR5(x) memory down
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- COM Express® mini Type 10 with Intel Atom® x6000E, Pentium® and Celeron® Series
- Low-Power – Performance/Watt optimized form factor solution
- Up to 16 GByte LPDDR4 memory down (In-Band ECC)
- 2x USB 3.1/2.0, 6x USB 2.0, USB client optional, 2x SATA, eMMC Flash
- TSN support
- Industrial grade temperature
- COM Express® mini Type 10 with Intel® Atom® E3900, Pentium® and Celeron® Processor Series
- Low-Power – Performance / Watt optimized small form factor solution
- Up to 8 GByte DDR3L memory down (ECC / non ECC)
- 2x USB 3.0/2.0, 6x USB 2.0, 2x SATA, eMMC Flash
- Industrial grade temperature
- Support of Kontron’s Embedded Security Solution – APPROTECT (optional)
- COM Express® mini Type 10 with Intel® Atom® E3900, Pentium® and Celeron® Processor Series
- Low-Power – Performance / Watt optimized small form factor solution
- Up to 16 GByte DDR3L memory down (non ECC)
- 2x USB 3.0/2.0, 6x USB 2.0, 2x SATA, eMMC Flash
- Industrial grade temperature
- Support of Kontron’s Embedded Security Solution – APPROTECT (optional)
- COM Express® mini Type 10 with Intel® Atom™ E3800 & Celeron® Series
- Up to 4GB DDR3L memory down (ECC optional)
- 1x USB 3.0, up to 7x USB 2.0, 1x USB client (optional), eMMC Flash, 2x SATA, SD-Card
- Commercial & Industrial Grade Temperature
- Intel® 11th Gen Core Processors, up to 8Core/16T, L3 Cache 24M
- Intel Iris Xe(Gen 12) graphics, 4 independent 4K display
- Dual channel DDR4 Max 128GB SODIMM, support ECC
- Super speed I/O: PCIe4 x16 (16GT/s), USB3.2 gen3 (10Gb), 2.5GbE(w/TSN), SATA3 (6Gb)
- TPM2.0 security protection, onboard NVMe SSD fast & anti-vibration
- Supports iManager, Edge-AI Suite, DeviceOn
- COM Express R3.0 Basic Module Type 7 pin out
- Intel® Xeon® Processor D-1500 Product Family
- Solder-down Memory and SSD w/ ECC
- High speed Ethernet (dual 10GBASE-KR interfaces, one GbE)
- Abundant expansion. (PCIe x16, PCIe x8, 8 PCIe x1)
- Supports iManager, WISE-PaaS/DeviceOn and embedded software APIs
- 9th/8th Gen Intel Xeon/Core Processors COM Express Basic Module Type 6
- 3* DDI (digital display interface) 4k resolution
- 4* USB3.1 Gen 2 (10Gbps) / PEG x16 & 8* PCIe Gen3 (8Gbps)
- 6C CPU with 96GB large memory capacity
- AMD Ryzen Embedded V1000 COM Express Basic Module Type 6
- Dual channel DDR4, Max 32GB (Both ECC & Non-ECC)
- Supports Quad independent symmetrical displays (4 4K Displays)
- Rich IO Interfaces-2 SATA, 2 USB 3.1 Gen2, 1 USB 3.1 Gen1, 8 USB 2.0, 2 COM, TPM
- Supports iManager, WISE-PaaS/RMM and Embedded Software APIs
- 11th Generation Intel® Core™ Processor U-Series
- COM Express R3.0 Compact Module Type 6 Pinout
- Dual channel with one memory down and one SODIMM
- High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2
- Onboard NVMe x4 SSD up to 64GB, TPM2.0
- Supports iManager, Embedded Software APIs and WISE-DeviceOn
- COM Express® R3.0 Compact Module Type 6 Pinout
- Intel® Pentium®/Celeron® and Atom® x6000 Series (Elkhart Lake) Processors
- Dual Channel up to 32GB DDR4-3200 and IBECC Supported by Specific SKUs
- Supports up to 3 simultaneous display: LVDS/eDP, HDMI/DisplayPort
- Supports onboard eMMC Storage and 2.5GbE
- Supports iManager, WISE-DeviceOn, and Embedded Software APIs
- Intel® Pentium® N4200, Celeron® N3350, and Atom® E3900 Series COM Express Compact Module Type 6
- 8GB, dual Channel 1866 DDR3L memory (A1: non-ECC ; B1: ECC)
- Supports up to 3 simultaneous display: LVDS/eDP, VGA, HDMI/DisplayPort
- Supports H.264/AVC, H.265/HEVC, VP9, VP8 HW DECODE
- Supports Wide-range opreating temp./wide range power input 4.75 ~ 20 V
- AMD Embedded Ryzen 7nm SoC – V2000 APU
- COM Express® R3.0 Compact Module Type 6 Pinout
- Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC)
- High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0
- Four Display (DP++, HDMI, VGA, LVDS)
- Supports iManager, Embedded Software APIs and WISE-DeviceOn
- COMe Mini Type-10
- Intel® Tiger Lake UP3 processors
- 16GB LPDDR4X 4266MT/s and IBECC support
- USB4 Compliance supported by carrier board design
- NVMe SSD onboard
- Operating temperatures: Standard 0 ~ 60 °C (32 ~140 °F) or Extended -40 ~ 85 °C (-40 ~ 185 °F)
- COM R.2.1 Type 10 Mini Module
- Intel® Atom™ E3900 & Pentium® / Celeron® Processor
- Max 8GB DDR3L onboard memory (support ECC, E3900 SKU only)
- Dual Display: LVDS, HDMI/DisplayPort
- onboard eMMC(default 32GB), TPM2.0
- Supports H.264/AVC, H.265/HEVC, VP9, VP8 HW DECODE
- Supports Wide-range operating temp./Wide range power input 4.75 ~ 20 V
- iManager and Embedded Software APIs
Consulting & Support
Do you have any further questions about Computer-On-Modules? We will be happy to answer any questions you may have. As Germany’s leading system integrator, we provide our customers with individual support in the area of Computer-On-Modules and quickly find customized solutions.
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