High Performance Embedded PCS

Increasingly, image and video analytics, artificial intelligence and the real-time processing of large amounts of data on-site (at the edge) are playing a decisive role. However, these environments far from server rooms and data centers are not suitable for classic servers. This is where particularly high performance embedded PCs come into play.

The experts at Aaronn Electronic will be happy to work with you to determine which are the right embedded box PCs for your company and your applications, how several models can be optimally combined or which individual adaptations are possible and necessary.

  • Powered by Intel® 2nd Gen. Xeon® D-1700 series processor up to 10 cores
  • 4x DDR4 SO-DIMM sockets support ECC/non-ECC memory up to 128GB
  • Versatile expansion options with PCI, PCIex4, PCIex16, M.2 B Key and E key
  • Support PCIex16 high performance graphic card up to 350W
  • 2x 10GbE port for fast data communication (optional)
  • Up to 4 x 2.5″ SATAIII HDD bay
  • IPMI 2.0-compliant management with reliability and security enhancements
  • Support Intel® 12th&13th Gen Core™ i3/i5/i7/i9 processor
  • Triple independent display: HDMI + HDMI + Optional Display
  • DDR5 SO-DIMM ECC/non-ECC memory support up to 64 GB
  • 9-36VDC wide range power input
  • Up to 3sets 2.5″ hard drive bays, support Intel® SW RAID
  • Support up to 4GbE, 8USB, 8COM, 16bit DIO, 2CANBus, TPM2.0
  • SUSI API, WISE-DeviceOn, McAfee and Acronis bundled
ark 3532b advantech
  • Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor
  • Triple independent display: VGA + HDMI + Optional Display
  • DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB
  • 9-36VDC wide range power input
  • Up to 4sets 2.5″ hard drive bays, support Intel® SW RAID
  • Support 4GbE, 8USB, 6COM, 16bit DIO, TPM2.0
  • SUSI API, WISE-DeviceOn, McAfee and Acronis bundled
  • 2 x Independent USB 3.0 with lockable design
  • No RED Certification
ark 3532c advantech
  • Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor
  • Triple independent display: VGA + HDMI + Optional Display
  • DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB
  • 9-36VDC wide range power input
  • Up to 4sets 2.5″ hard drive bays, support Intel® SW RAID
  • Support 4GbE, 8USB, 6COM
  • No RED Certification
advantech ark 3531
  • Supports Intel® 8th and 9th Gen Core™ i3/i5/i7/i9 35W processor
  • Dual display: VGA + HDMI
  • DDR4 SO-DIMM memory support up to 64 GB
  • 9-36VDC wide range power input
  • Versatile I/Os including 2 x USB 3.1, 6 x USB 3.0 and 8 x COM ports
  • Support 2 internal 2.5″ Hard Drive bays (Intel SW RAID 0/1)
ARK-3530 advantech
  • Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor
  • Triple independent display: VGA + HDMI + Optional Display
  • DDR4 SO-DIMM memory support up to 32 GB
  • 9-36V power module compatible with all-in-one ordering
  • Optional modular design for 2.5″ hard drive bays: internal /removable (support up to 4 sets)
  • Advantech iDoor module compatible
  • Advantech EMIO miniPCIe module compatible with all-in-one ordering
ARK-3530L advantech
  • Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor
  • Triple independent display: VGA + HDMI + Optional Display
  • DDR4 SO-DIMM memory support up to 32 GB
  • Option 9-36V power module compatible with all-in-one ordering
  • Optional modular design for 2.5″ hard drive bays: internal /removable (support up to 4 sets)
  • Advantech iDoor module compatible
  • Advantech EMIO miniPCIe module compatible with all-in-one ordering
  • Advantech ARK Plus AMO-3xxx series module compatible
ARK-3520P advantech
  • Intel® Core™ i3/i5/i7 processor (BGA)
  • Triple independent display: VGA + HDMI + Option Display
  • DDR4 SO-DIMM memory up to 32 GB
  • Flexible Expansion via PCI/PCIex4
  • 9-36V wide range Power input
  • Versatile I/Os including 6 x high speed USB 3.0 and 8 x COM ports
  • 2 Removable 2.5″ HDD drive bay
  • Advantech iDoor module compatible
AIR-300
  • Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 up to 65W CPU
  • Dual independent display: VGA + HDMI
  • Dual channel DDR4 SO-DIMM memory support up to 32 GB
  • 850W power supply built-in
  • PCIe x16 Graphics card support up to 260W
  • Two swappable 2.5″ hard drive bay
DLAP-3000-CF Series
  • ADLINK MXM Graphics module support (Type A/B, up to 120W)
  • 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor
  • Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)
  • DisplayPort (2 from CPU, 4 from MXM)
  • 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module
  • Reliable Molex type 12V DC-in connector
DLAP-3200-CF Series
  • ADLINK MXM Graphics module support (Type A/B, up to 120W)
  • 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor
  • Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)
  • DisplayPort (2 from CPU, 4 from MXM)
  • 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module
  • Reliable Molex type 12V DC-in connector
  • 1x Intel® i219-LM and 3x Intel® i210-AT
  • 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
DLAP-8000 Series
  • 9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset
  • Dual SODIMMs for up to 64GB DDR4 / ECC options*
  • Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0
  • 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0
  • Up to 4 hot swappable 2.5″ SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280
  • Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM
  • Front accessible I/O and adaptive Function Module v.2 option
  • Flexible and powerful PCIe expansions via backplane
IPC-242 advantech
  • Intel 10th Gen Core i Desktop LGA 1200 CPU supported with Q470E/H420E chipset
  • Compact design for small cabinet or limited space
  • 2 – 3 independent displays (HDMI/VGA/DP or DVI)
  • 4 expansion slots (PCIe/PCI)
  • Rich I/O: 2 x GbE, 6 x USB3.2, 1 x NVMe M.2, 2 x SATAIII, 2 x RS-232/422/485 Serial Ports, 1 x internal USB 2.0
  • 1 x swappable HDD/SSD tray
  • 250W Flex ATX power support
  • Supports power output 5V/12V (max. 2A)
  • Dimension: 333 (W) x 269.2 (D) x 88 (H) mm
MIC-770 V3
  • Intel® 12th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with R680E/H610E chipset
  • Two SO-DIMMs up to 64 GB (ECC) DDR5 4800 MHz
  • Quad displays of DP/HDMI/VGA and dual GbEs
  • M.2, SATA RAID 0, 1, 5, 10, USB 3.2 (Gen2)
  • Supports iModules, Flex I/Os and iDoors
  • Supports Advantech out-of-band remote management solution – iBMC 1.2 + DeviceOn
MIC-770 V2 Advantech
  • Intel® 10th Gen Xeon®/Core™ i CPU socket-type (LGA1200) with Intel® W480E/H420E chipset
  • Wide operating temperature (-10 ~ 60 °C)
  • VGA and HDMI output
  • 2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1)
  • 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)
  • 1 x 2.5″ HDD/SSD, and 1 x mSATA
  • 9 ~ 36 VDC input power range
  • Supports FlexIO and iDoor technology, flexible configure additional HDMI, DVI, Comport, DIO, Remote switch IO
  • Supports Advantech i-Modules
MIC-770_Advantech
  • Intel® 8th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q370/H310 chipset
  • Wide operating temperature (-10 ~ 50 °C)
  • VGA and HDMI output
  • 2 x GigaLAN, 2 x USB 3.1 and 6 x USB 3.0
  • 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)
  • 1 x 2.5″ HDD/SSD, and 1 x mSATA
  • 9 ~ 36 VDC input power range
  • Supports 2 x LAN, isolation COMs, and 32-bit GPIO modules
  • Supports Advantech i-Modules
  • Supports Advantech SUSIAccess and embedded software APIs
Advantech MIC-7700
  • Intel® 6th/7th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q170/ H110 chipset
  • 2 x RS-232/422/485 and 4 x RS232 serial ports (with expansion cable)
  • 1 x 2.5″ HDD, 1 x CFast, 1x mSATA and 1 mini-PCIe with SIM
  • Supports 2 LAN, Isolation COM, 32-bit GPIO modules
  • 2 x GigaLAN and 8 x USB 3.0
  • VGA and DVI output
  • Supports Advantech’s i-module, SUSIAccess, and embedded software APIs
  • 9 ~ 36 V DC input power range
  • Versatile LED for system status and alarmWide operating temperature
  • Based on 11th Gen Intel® Core™ or Intel® Xeon® processors for demanding control tasks in the smart factory
  • Up to 4 TSN ports for future-oriented TSN automation solutions
  • Highest system availability: fanless up to +65 °C, optional Goldcap and redundant power supply, Recovery Button
  • High flexibility and expandability: Up to 4x PCIe Slots, mPCIe & M.2, 4x GbE, 6x USB, up to 3x DP …
Kbox C-103-CFL
  • Based on latest 8th/9th Gen Intel® Core™ or Xeon® E for demanding applications
  • Highest system availability: Fanless up to 70 °C, redundant PSU option, recovery button, goldcap backup
  • Optimized for control applications: Fieldbus integration & NVRAM option
  • High flexibility and expandability: Up to 4x PCIe Slots, mPCIe & M.2, 4x GbE, 6x USB, up to 3x DP
MXC-6600 Adlink Technology
  • 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor
  • Dual SODIMMs for up to 32GB DDR4
  • Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0
  • 2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0
  • Rich storage: up to 4 internal 2.5″ SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
  • Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM
  • Flexible modular expansion with 2 or 4 slots
MXC-6400_Series Adlink Technology
  • 6th Generation Intel® Core™ i7/i5/i3 Processors and QM170 chipset
  • 2x DDR4 SO-DIMM sockets support up to 32GB memory
  • 1x PCI and 2x PCIe Gen3 x8 (or 1x PCIe Gen3 x16) slots
  • 2x Mini PCIe and 1x USIM slots
  • Support for 3 independent displays with 2x DisplayPort and 1x DVI-I ports
  • 3x Intel® GbE LAN ports with teaming function, Intel® iAMT 11.0
  • 2x 2.5″ hot-swappable SATA III (6.0 Gb/s) trays on the front panel and 2x internal SATA III (6Gb/s) ports with RAID 0/1/5/10 support
  • Remote power on/off switch connector on the front panel
MVP-6120 Adlink Technology
  • 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor
  • Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC
  • Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0
  • 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0
  • Rich storage options: up to 4x 2.5″ SATA, M.2 2280
  • Front accessible I/O and adaptive Function Module 2.0 options
  • Flexible functionality expansion: Expansion slots for standard PCIe and PCI card, Embedded slots for Mini PCIe, M.2 3042, 2x USIM
  • World leading embedded GP/GPU computing options built-in
Adlink Technology MVP-6100 series_web
  • 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor
  • Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory
  • Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0
  • 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0
  • Rich storage: up to 4x 2.5″ SATA, CFast, M.2 2280
  • Embedded Expansion: Mini PCIe/ M.2 3042/ 2x USIM
  • Front accessible I/O and adaptive Function Module v.2 option
  • Flexible modular expansion with 2 or 4 slots
  • 9th Gen Intel® Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor
  • Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory
  • Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/ TPM2.0
  • 2x USB3.1 Gen2 + 1x USB3.1 Gen1 + 3x USB2.0
  • Rich storage:2x 2.5″ SATA, CFast, M.2 2280
  • Embedded Expansion: Mini PCIe/ M.2 3042/ 2x USIM
  • Front accessible I/O and adaptive Function Module v.2 option
MVP-6120 Adlink Technology
  • 6th Gen Intel® Core™ i7/i5/i3 processors with H110/Q170 chipset
  • Dual-channel DDR4 SO-DIMM sockets support up to 32GB memory
  • Support for 2 independent displays with 1 VGA, 1 DVI and 2 DisplayPort
  • MVP-6010: 1 PCIe Gen3 x16 and 3 PCI expansion slots
  • MVP-6020: 2 PCIe Gen3 x8 and 2 PCI expansion slots
  • 3 Intel® GbE ports with teaming function
  • 2 software-programmable RS-232/422/485 + 2 RS-232 ports
  • Extremely cost-effective, high performance Fanless system
  • Support up to 65W CPU with fanless operation
MVP-6000_Series Adlink Technology
  • 6th Gen Intel® Core™ i7/i5/i3 processors and H110 chipset
  • Dual-channel DDR4 SO-DIMM sockets support up to 32 GB memory
  • Support for two independent displays with 1 VGA, 1 DVI, and 2 DisplayPort
  • 1 PCIe Gen3 x16 and 1 PCI expansion slots
  • 3 Intel® GbE ports with teaming function
  • 2 software-programmable RS-232/422/485 + 2 RS-232 ports
  • Front-accessible I/O for simplified installation and maintenance
  • Extremely cost-effective, high performance fanless system
MXC-2300 Adlink Technology
  • Intel® Atom™ processor E3845 with 4C @1.91 GHz SoC
  • 2x DDR3L SO-DIMM, supporting up to 8GB memory
  • 2 PCI + 1 PCIe x4 or 3 PCI expansion slots
  • Built-in dual-port isolated CAN and 16-CH isolated DI and DO
  • 1 DisplayPort + 1 DVI-I
  • 2 Intel GbE ports with teaming function, 1 USB 3.0 + 4 USB 2.0 portsƒÜ
  • 2 software-programmable RS-232/422/485 + 2 RS-232 ports
  • Built-in ADLINK SEMA 2.2 (Smart Embedded Management Agent)
Adlink MXE-5600 Series Fanless Embedded Computer
  • 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset
  • Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory
  • Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0
  • 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0
  • Rich storage: 2x 2.5″ SATA 6 Gb/s, CFast, M.2 2280
  • 9th Gen Intel® Core™ i7/i5/i3 LGA processor
  • Dual SODIMMs sockets for up to 32GB DDR4
  • Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0
  • 3x USB 3.1 Gen 1, 3x USB 2.0
  • Rich storage options: 2x 2.5″ SATA, M.2 2280
EOS-i6000-M_Series Adlink Technology
  • Pre-installed AI development component reduces testing and integration efforts thus accelerating time-to-market
  • High product reliability guaranteed by well-validated power consumption, thermal design, and compatibility
  • Optimized hardware design and performance tuning for AI vision applications
  • Leverages up to 4x Intel® Movidius™ Myriad™ X VPUs to empower a wide variety of deep-learning applications
EOS-i6000-P1000_Series Adlink Technology
  • Pre-installed AI development component reduces testing and integration efforts thus accelerating time-to-market
  • High product reliability guaranteed by well-validated power consumption, thermal design, and compatibility
  • Optimized hardware design and performance tuning for AI vision applications
  • Widely supports the NVIDIA GPU portfolio to satisfy various deep- learning applications

Consulting & Support

Do you have any further questions about high performance Embedded PCs? We will be happy to answer any questions you may have. As Germany’s leading system integrator, we provide individual support for our customers in the field of embedded box PCs and quickly find customized solutions.

Together with our technology partners we find the best embedded solutions in the field of embedded box PCs. Contact us directly now!