System-on-module (OSM)

The main difference between System-on-Modules (SoM) and standards such as COM, QSeven or SMARC is that the modules are not plugged onto the carrier board but soldered. Apart from that, SoMs also combine CPU, flash and RAM as well as the power supply on a compact PCB. The OSM (Open Standard Module) standard, ratified in November 2020, defines the framework conditions for soldered System-on-Modules and ensures that modules from different manufacturers are uniform in terms of size, pin assignment, interfaces, cooling and power dissipation.

The Open Standard Module™ specification enables the development, production and distribution of embedded modules. For a wide range of IoT applications, it enables the benefits of modular embedded computing to be fulfilled in a small space, at low cost, and with a wide range of interfaces.

  • Four form factors
    1. Size-O: 15 x 30 mm
    2. Size-S: 30 x 30 mm
    3. Size-M: 30 x 45 mm
    4. Size-L: 45 x 45 mm
  • Solder modules can be fitted on both sides – “Flat” and “Extended” denote a modular concept for the height structure
  • NXP i.MX93, 2x Arm® Cortex®-A55 @1.7 GHz, 1x Arm® Cortex®-M33 @250 MHz 
  • 1x Arm® Ethos™ U-65 microNPU 
  • Security System EdgeLock® Secure Enclave
  • 2x Gigabit Ethernet IEEE 1588 (1x with TSN)
  • 2x CAN FD Embedded Linux (Yocto Distribution)
SOM-OSM-S i.MX8M Mini_Kontron
  • 4x Arm® Cortex®-A53 @1.6 GHz and 1x Arm® Cortex-M4 @400 MHz, 2D GPU, 3D GPU
  • LPDDR4-RAM 1 GByte up to 4 GByte, NOR-Flash 2 MByte, eMMC 4 GByte up to 64 GByte
  • Ethernet, USB, I/O, LCD interface, Camera interface
  • Operating system Embedded Linux (Yocto Distribution)
  • 4x Arm® Cortex®-A53 @1,6 GHz
  • 2x GbE-Lan and TSN functionality
  • 2x CAN FD
  • OSM form factor size S 30 mm x 30 mm
SL i.MX8M Mini kontron electronics
  • Quad Core with 1.6 GHz on just 30 mm x 30 mm
  • 4 x Arm® Cortex-A53 @1.6 GHz
  • 1 x Arm® Cortex-M4 @400 MHz
  • 1 GB up to 4 GB LPDDR4-RAM
  • Form factor 30 mm x 30 mm
  • Graphics, communication and realtime control in one single chip
  • 2x Arm® Cortex-A7 @650 MHz
  • 1x Arm® Cortex-M4 @200 MHz
  • 256 MB up to 512 MB DDR3-RAM
  • 1x CAN 2.0
  • Computing power, communication and graphic on 25 mm x 25 mm
  • i.MX6ULL 1x Arm® Cortex-A7 @800 MHz
  • i.MX6UltraLite 1x Arm® Cortex-A7 @528 MHz
  • 256 MB up to 512 MB DDR3-RAM
  • Form factor 25 mm x 25 mm

Consulting & Support

Do you have any further questions about System-On-Module (SOM)? We will be happy to answer any questions you may have. As Germany’s leading system integrator, we provide our customers with individual support in the area of System-On-Modules (SOM) and quickly find customized solutions.

Together with our technology partners we find the best embedded solutions in the field of System-On-Modules (SOM). Contact us directly now!