The main difference between System-on-Modules (SoM) and standards such as COM, QSeven or SMARC is that the modules are not plugged onto the carrier board but soldered. Apart from that, SoMs also combine CPU, flash and RAM as well as the power supply on a compact PCB. The OSM (Open Standard Module) standard, ratified in November 2020, defines the framework conditions for soldered System-on-Modules and ensures that modules from different manufacturers are uniform in terms of size, pin assignment, interfaces, cooling and power dissipation.
The Open Standard Module™ specification enables the development, production and distribution of embedded modules. For a wide range of IoT applications, it enables the benefits of modular embedded computing to be fulfilled in a small space, at low cost, and with a wide range of interfaces.
- Four form factors
- Size-O: 15 x 30 mm
- Size-S: 30 x 30 mm
- Size-M: 30 x 45 mm
- Size-L: 45 x 45 mm
- Solder modules can be fitted on both sides – “Flat” and “Extended” denote a modular concept for the height structure
Consulting & Support
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