Increased productivity for high-end edge computing platforms with the latest Intel® processor families Xeon® D-2800 and D-1800

Our technology partner – Kontron, a leading global provider of embedded IoT solutions, introduces the COM-HPC® server module COMh-sdID, based on the Intel® Xeon® D-2800 processor. Kontron also presents the COM-HPC® Server Module COMh-sdIL and the COM-Express® Basic COMe-bID7 with the Intel® Xeon® D-1800 processor. These three modules offer application developers outstanding scalability and flexibility for powerful edge computing.

COMh-sdID with Intel® Xeon® D-2800 processor

The COMh-sdID server module from Kontron is a powerful solution for high-end edge computing applications. With a size of 160 x 160 mm, it offers impressive scalability from 4 to 20 cores. The module has 4x DIMM sockets for up to 512 GB DDR4 memory with a speed of 3200 MT/s. An optional soldered NVMe SSD with a capacity of up to 1 TByte is also available. With 48 PCIe lanes (32 PCIe Gen4 plus 16 PCIe Gen3 lanes) and 2 Quad LAN interfaces that support up to 100 Gbit Ethernet, the COMh-sdID offers extensive interface and communication interfaces.

Kontron COM

Fig.1: COMh-sdID

COMh-sdIL with Intel® Xeon® D-1800 processor

The COMh-sdIL server module is a compact and robust solution for edge computing applications. With dimensions of 120 x 160 mm in “Size D small” format, it offers a space-saving design. All components are soldered, making the module shock and vibration resistant and ideal for outdoor applications. It offers 16 PCIe Gen4 plus 16 PCIe Gen3 lanes and a maximum of 64 GB soldered DDR4 memory at 2933 MT/s. An optional soldered NVMe SSD with up to 1 TByte storage capacity is available.

Fig.2: COMh-sdIL

COMe-bID7 with Intel® Xeon® D-1800 processor

The COMe-bID7 COM-Express® module from Kontron offers a robust and space-saving implementation for demanding environments. Based on the Intel® Xeon® D-1800 processor, it offers scalability from 4 to 10 cores in a small form factor. The module has up to 4x SO-DIMM sockets for a maximum of 128 GB memory. An optional soldered NVMe SSD with up to 1 TByte storage capacity is available. With 16 PCIe Gen4 plus 16 PCIe Gen3 lanes and 4x 10GBASE-KR interfaces, the COMe-bID7 offers ideal support for high data throughput rates in demanding I/O and network structures.

kontron COMe-bID7

Fig.3: COMe-bID7

Robust and scalable high-performance modules

All three Kontron modules offer robust performance in the harshest environments. They are designed for the extended industrial temperature range of -40 °C to +85 °C and offer 24/7 reliability over 10 years. With scalable performance supported by Intel® QuickAssist Technology (QAT) and AI acceleration with Intel® AVX-512, the modules are ideal for complex AI applications, high-performance networking platforms and edge servers. Thanks to real-time capabilities as well as low latency and determinism through Intel® Time Coordinated Computing (TCC) and Time Sensitive Networking (TSN), the platforms are perfectly suited for use in high-performance IoT edge computing applications.

More info

Our experienced and reliable Key Account Managers and Solution Architects are at your disposal for further information and will support you with your individual solution. Please do not hesitate to contact us now! 

For more information about the COM-HPC series please click here.

For more information about the COMe series please click here.

Source: Kontron

Your direct contact person

Stefanie Fließ
Key Account Manager
Tel.: +49 89-894577-14